Method and apparatus for loading solder balls

A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board, comprising:

• a holding device configured to hold a printed wiring board having a plurality of pads and to hold a ball array mask having a plurality of openings that correspond to pads of the printed wiring board;
• at least one cylinder member positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member being configured to gather solder balls on a surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member;
• and
• a conveyor mechanism configured to move the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device.