Method for construction, strengthening and homogenization of a wafer
OwnerShura LEEinventor
Life of this patent
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Abstract
The present invention provides a method for strengthening, homogenization and construction of a wafer. The concave and convex portions are processed by laser or etching, and then formed at intervals on the grinding surface of the wafer. The concave and convex portions are round or polygonal shapes. With the alternated arrangement of the concave and convex portions, a mesh structure of consistent construction is formed on the grinding surface of the wafer, making it possible to cut down greatly the interference and influence generated by the texture of grinding surface, and improve substantially the structural strength of the grinding surface for a consistent quality of wafer with better applicability and industrial benefits.
Claims6
A method for strengthening and homogenization of a wafer, comprising the steps of:
- cutting to form a flaky wafer with a grinding surface;
- processing and shaping concave and convex on portions of said grinding surface at intervals, said grinding surface of the wafer having levelness set by the portions.
Dependencies are inferred from the claim text.