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US 2012/0058440 A1Published application
Oven for Semiconductor Wafer
AssigneeKabushiki Kaisha Toshiba
InventorSeiji NAKAGAWA
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Abstract
An oven is described that can more evenly heat the semiconductor wafer, even though the wafer may warp during heating. The oven may provide relatively uniform heating even though the type and location of warping may be unpredictable for any given wafer. The oven may have a heating surface divided into a plurality of heating zones that may each independently provide a given amount of heat to the wafer. The amount of heat provided by each zone may be determined using signals from sensors that sense the warping of the wafer.
Claims5
A method for heating a semiconductor wafer, comprising:
- first applying a first amount of heat to the semiconductor wafer;
- sensing whether the semiconductor wafer has a warp;
- in response to sensing that the semiconductor wafer has a warp, applying a second amount of heat to the semiconductor wafer, wherein the second amount of heat is different from the first amount of heat;
- and
- in response to sensing that the semiconductor wafer does not have a warp, second applying the first amount of heat to the semiconductor wafer.
2 more elements
Dependencies are inferred from the claim text.