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US 2012/0056309 A1Published application
Semiconductor device with reduced heat-induced loss
AssigneeDisco Corporation
InventorYoungsuk Kim
Life of this patent
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Abstract
A semiconductor device which is capable of reducing a heat-induced loss includes a substrate and a circuit element disposed on the substrate. The substrate is of a rectangular shape with beveled surfaces on four corners thereof.
Claims2
A semiconductor device comprising:
- a substrate;
- and
- a circuit element disposed on said substrate;
- wherein said substrate is of a rectangular shape with beveled surfaces on four corners thereof.
1 more element
Dependencies are inferred from the claim text.