Semiconductor memory device and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorsMasayoshi IWAYAMA, Hiroyuki Kanaya
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AssigneeKabushiki Kaisha Toshiba
InventorsMasayoshi IWAYAMA, Hiroyuki Kanaya
Estimating the term…
A semiconductor memory device according to the present embodiment includes a semiconductor substrate, a select transistor, a lower electrode, a magnetic tunnel junction element, a first protection film, an upper electrode, and a second protection film. The select transistor is formed on the semiconductor substrate. The lower electrode is electrically connected to one diffusion layer of the select transistor. The magnetic tunnel junction element is provided on the lower electrode. The first protection film is provided on a side surface of the magnetic tunnel junction element. The upper electrode is provided on the magnetic tunnel junction element and the first protection film. The second protection film is provided on side surfaces of the upper electrode, the first protection film, and the lower electrode.
A semiconductor memory device comprising:
A method of manufacturing a semiconductor memory device, comprising:
Dependencies are inferred from the claim text.