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US 2012/0055506 A1Published application
Substrate cleaning method
AssigneeTokyo Electron Limited
InventorsTsuyoshi Moriya, Shin Yokoyama, Kikuo Okuyama
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AssigneeTokyo Electron Limited
InventorsTsuyoshi Moriya, Shin Yokoyama, Kikuo Okuyama
Estimating the term…
In a substrate cleaning method for cleaning a substrate with fine patterns having grooves or holes whose representative length is 0.1 mm or less, the substrate is arranged in a space which contains water, such that the substrate faces an acute-angled leading end of a discharge electrode which can be cooled, with a predetermined interval therebetween, with a counter electrode being interposed at a predetermined position between the substrate and the discharge electrode. Then, a predetermined voltage is applied between the discharge electrode and the counter electrode while generating dew condensation in the discharge electrode by cooling the discharge electrode. The substrate is cleaned by generating an aerosol containing water particles having sizes of equal to less than 10 nm in the leading end of the discharge electrode and spraying the aerosol on the substrate.
A substrate cleaning method for cleaning a substrate with fine patterns formed thereon, wherein the fine patterns have grooves or holes whose representative length is equal to or less than 0.1 μm, the method comprising:
A substrate cleaning method for cleaning a substrate with fine patterns formed thereon, wherein the fine patterns have grooves or holes whose representative length is equal to or less than 0.1 μm, the method comprising:
Dependencies are inferred from the claim text.