Cooled universal hardware platform

A cooled universal hardware platform, comprising:

• a frame including a module insertion area on a first side of a rack and a universal backplane mounting area on a second side of the rack opposite to the first side;
• a power bus to provide power to the universal backplane mounting area;
• a plurality of cooled partitions coupled within the frame perpendicular to the first side of the rack;
• a plurality of module bays defined by a volume of space between each consecutive cooled partition of the plurality of cooled partitions, wherein each module bay has a pitch (P) equal to a distance between a first surface of one cooled partition to and a second surface of an adjacent cooled partition;
• two or more service unit backplanes coupled to the universal backplane mounting area and to the power bus, each service unit backplane including one or more connectors configured to connect to corresponding two or more service units having two or more respective service functions;
• and
• a coolant source coupled to the plurality of cooled partitions, wherein each cooled partition includes capillaries between a first surface and a second surface of each cooled partition to permit coolant flow within the cooled partitions and to provide cooling to each module of the two or more service units.