Universal conduction cooling platform
AssigneeGraphStream Incorporated
InventorsJohn Craig Dunwoody, Teresa Ann Dunwoody
Life of this patent
Estimating the term…
Abstract
Disclosed is an embodiment of a module for insertion between a first shelf and a second shelf of a rack based processing system. The module includes a first thermal plate substantially parallel to a second thermal plate. An inner surface of the first thermal plate faces an inner surface of the second plate and an outer surface of each of the first and second thermal plates faces opposite to the respective inner surfaces. Each thermal plate is configured to thermally couple to one or more component units locatable between the inner surfaces of the first and second thermal plates.
Claims20
A module for insertion between a first shelf and a second shelf of a rack based processing system, the module comprising:
- a first thermal plate substantially parallel to a second thermal plate, an inner surface of the first thermal plate facing an inner surface of the second plate and an outer surface of each of the first and second thermal plates facing opposite to the respective inner surfaces;
- and
- each thermal plate configured to thermally couple to one or more component units locatable between the inner surfaces of the first and second thermal plates.
A conduction cooling apparatus for a rack based processing system, the apparatus comprising:
- a frame including a module insertion area on a first side of the rack;
- a plurality of shelves within the frame and coupled to a coolant source, each shelf having a first surface and a second surface and configured to permit coolant flow between the first and second surfaces, the plurality of shelves being positioned substantially parallel to each other and substantially perpendicular to a plane of the first side of the rack;
- a plurality of bays, each bay defined by a volume of space between adjacent ones of the plurality of shelves;
- and
- a module unit configured to be inserted into a bay of the plurality of bays, the module unit including:
- a first thermal plate substantially parallel to a second thermal plate, an inner surface of the first thermal plate facing an inner surface of the second plate and an outer surface of each of the first and second thermal plates facing opposite to the respective inner surfaces;
- and
- each thermal plate configured to thermally couple to one or more component units locatable between the inner surfaces of each thermal plate.
A method of cooling one or more component units in a frame of a rack based processing system, the method comprising:
- providing coolant to a plurality of shelves coupled within the frame, wherein each shelf includes a first surface and a second surface, the coolant flowing between the first and the second surfaces;
- and
- cooling the one or more component units coupled to a module unit inserted between a first shelf and a second shelf, wherein each module unit includes a first plate substantially parallel to a second plate and the one or more component units locatable between each parallel plate providing a thermal coupling of the one or more component units to at least one of the first shelf and the second shelf.
Dependencies are inferred from the claim text.