Integral latch mechanisms for mounting electronics modules

A wireless radio electronics module with locking mechanism, the module comprising:

• one or more high power electronic components;
• a heat transferring interface that receives thermal energy emitted from the one or more high power electronic components;
• a lever arm component rotatably coupled to a first side of the electronics module and a second side of the electronics module that opposes the first side,
• wherein the lever arm component rotates about a first axis that passes through the electronics module;
• a first latching arm component including a first latching hook, the first latching arm component rotatably coupled to the lever arm component on the first side of the electronics module, wherein the first latching arm component rotates about a second axis that run parallel to and offset from the first axis;
• a second latching arm component including a second latching hook, the second latching arm component rotatably coupled to the lever arm component on the second side of the electronics module, wherein the second latching arm component rotates about the second axis that runs parallel to and offset from the first axis;
• at least one secondary fastener coupled to the electronics module;
• wherein the first axis and second axis are oriented in an over-center configuration such that when the lever arm component is rotated about the first axis from a first position to a second position, the second axis will pass through a locking axis;
• wherein when the lever arm component is rotated about the first axis from the first position to the second position, the first latching hook and the second latching hook apply a force that presses the heat transferring interface against a heat sink of an electronics enclosure.

A system for securing a wireless radio electronics module within an electronics enclosure, the system comprising:

• a first electronics module that includes
• one or more high power electronic components;
• a heat transferring interface that receives thermal energy emitted from the one or more high power electronic components;
• a lever arm component rotatably coupled to a first side of the electronics module and a second side of the electronics module that opposes the first side, wherein the lever arm component rotates about a first axis that passes through the electronics module;
• a first latching arm component including a first latching hook, the first latching arm component rotatably coupled to the lever arm component on the first side of the electronics module, wherein the first latching arm component rotates about a second axis that run parallel to and offset from the first axis;
• a second latching arm component including a second latching hook, the second latching arm component rotatably coupled to the lever arm component on the second side of the electronics module, wherein the second latching arm component rotates about the second axis that runs parallel to and offset from the first axis;
• and
• at least one secondary fastener coupled to the electronics module;
• wherein the first axis and second axis are oriented in an over-center configuration such that when the lever arm component is rotated about the first axis from a first position to a second position, the second axis will pass through a locking axis;
• and
• an electronics enclosure that includes
• a backplane that includes a heat sink;
• a first hook mechanism shaped to engage the first latching hook and the second latching hook;
• a second hook mechanism shaped to engage the secondary fastener;
• and
• at least one door secured to the backplane;
• wherein when the lever arm component is rotated about the first axis from the first position to the second position, the first latching hook and the second latching hook apply a force that presses the heat transferring interface against the heat sink of the electronics enclosure.