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US 2011/0300610 A1Published application
Thermally Conductive Microplate
AssigneeLife Technologies Corporation
InventorsGary Lim, Quentin F. Polosky
Life of this patent
Estimating the term…
Abstract
Embodiments according to the present teachings of a microplate comprising a main body portion having a first surface and an opposing second surface are disclosed. A plurality of wells are formed in the first surface, each of the plurality of wells being sized to receive an assay therein. A backing is coupled to the opposing second surface of the main body portion.
Claims20
A microplate comprising:
- a main body portion having a first surface and an opposing second surface;
- a plurality of through holes formed in said main body portion, each through hole being disposed about a respective axis normal to said second surface;
- and
- a backing coupled to the main body portion, said backing including a first layer comprising an adhesive, a second layer comprising a backing material coupled to said main body portion via said adhesive, and a third layer comprising a thermally conductive material coupled to said second layer, said second layer and third layer each covering said plurality of through holes so that each of said respective axes passes through said backing material and through said thermally conductive material.
1 more element
A microplate comprising:
- a main body portion extending along a plane;
- a plurality of through holes formed in said main body portion, each through hole being disposed about a respective axis normal to said plane;
- and
- a backing coupled to said main body portion, said backing including a first layer comprising a backing material coupled to said main body portion, a second layer comprising a thermally conductive material coupled to said second layer, and an adhesive layer coupling together said first layer and said second layer, said first layer and said second layer each masking said plurality of through holes so that each of said respective axes passes through said backing material and through said thermally conductive material.
1 more element
Dependencies are inferred from the claim text.