Expansion card assembly and heat sink thereof

An expansion card assembly comprising:

• an expansion card comprising a board and an electronic component mounted on the board, the board having a component side and an opposite solder side, the electronic component being mounted on the component side and located adjacent to an end of the board;
• and
• a heat sink for dissipating heat of an expansion card, the heat sink comprising:
• a U-shaped base comprising:
• a heat absorbing plate;
• a heat dissipation plate opposite to the heat absorbing plate;
• and
• a connecting plate between the heat absorbing plate and the heat dissipation plate, a receiving space being defined between the heat absorbing plate and the heat dissipation plate, the end of the board of the expansion card adjacent to the electronic component received in the receiving space of the base, the heat absorbing plate and the heat dissipation plate of the base of the heat sink being respectively located at the component side and the solder side of the board of the expansion card to sandwich the end of the board therebetween, the heat absorbing plate being attached to the electronic component.

A heat sink for dissipating heat of an expansion card, the heat sink comprising:

• a U-shaped base comprising:
• a heat absorbing plate;
• a heat dissipation plate substantially parallel to the heat absorbing plate;
• and
• a connecting plate between the heat absorbing plate and the heat dissipation plate, a receiving space being defined between the heat absorbing plate and the heat dissipation plate, the receiving space sized to fittingly receive an end of the expansion card therein such that an inner surface of the heat absorbing plate thermally contacts an electronic component mounted on the expansion card.