Stacked interposer leadframes
AssigneeLinear Technology Corporation
InventorDavid Alan PRUITT
Life of this patent
Estimating the term…
Abstract
A stacked leadframe assembly is disclosed. The stacked leadframe assembly includes a first die having a surface that defines a mounting plane, a first leadframe stacked over and attached to the first die, a second die stacked over and attached to the first leadframe; and a second leadframe stacked over and attached to the second die. The leadframes have die paddles with extended side panels that have attachment surfaces in the mounting plane.
Claims23
A stacked leadframe assembly comprising:
- a first die having a surface that defines a mounting plane;
- a first leadframe having a die paddle with extended side panels that have attachment surfaces in the mounting plane, the first leadframe being stacked over and attached to the first die;
- a second die, stacked over and attached to the first leadframe;
- and
- a second leadframe having a die paddle with extended side panels that have attachment surfaces in the mounting plane, the second leadframe being stacked over and attached to the second die.
An integrated circuit device, comprising:
- a substrate having circuitry;
- and
- at least one stacked leadframe assembly attached to the substrate, the stacked leadframe assembly comprising:
- a first die;
- a first leadframe stacked over the first die;
- at least one second die stacked over the first leadframe;
- and
- at least one second leadframe stacked over the second die.
A method of manufacturing stacked leadframe assemblies, comprising the steps of:
- placing a first die on a carrier;
- placing a first leadframe over the first die and attaching the first leadframe to the first die;
- placing a second die over the first leadframe and attaching the second die to the first leadframe;
- and
- placing a second leadframe over the second die and attaching the second leadframe to the second die.
Dependencies are inferred from the claim text.