Integrated circuit packaging system with increased connectivity and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• forming a lead frame having contact pads and connection leads including forming a tie bar for positioning the contact pads;
• coupling a base integrated circuit to the contact pads including coupling a chip interconnect between the contact pad and the base integrated circuit;
• coupling a chip interconnect between the base integrated circuit, the connection leads, the contact pads, or a combination thereof including coupling a bonding pad, a bond finger, the tie bar, or a combination thereof;
• molding a package body on the connection leads, the base integrated circuit, and the chip interconnects, including having the contact pads exposed including injecting an epoxy molding compound;
• and
• forming a bottom surface on the package body including forming the connection leads to be coplanar with the bottom surface.

An integrated circuit packaging system comprising:

• a package body having contact pads and connection leads exposed;
• a base integrated circuit coupled to the contact pads;
• chip interconnects between the base integrated circuit, the connection leads, the contact pads, or a combination thereof;
• and
• a bottom surface on the package body with the connection leads formed coplanar to the bottom surface.