Semiconductor chip
AssigneePanasonic Corporation
InventorKeiji Miki
Life of this patent
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Abstract
A semiconductor wafer 10 has a plurality of semiconductor chip areas 10a and a scribe area 10b, each of the semiconductor chip areas 10a having semiconductor elements and electrode pads (electrode portions) 16a electrically connected to the respective semiconductor elements, the scribe area 10b having monitor elements and electrode pads (electrode portions) 16b electrically connected to the monitor elements, wherein projecting electrodes 18 are selectively formed only on the respective electrode pads 16a in the semiconductor chip areas 10a by electroless plating. Thus, for example, the electrode pads 16b are covered with an insulating film 14.
Claims15
1-18. (canceled)
A semiconductor chip comprising;
- a substrate having a semiconductor chip area thereon, the semiconductor chip area having semiconductor elements therein, first electrode pads electrically connected to the respective semiconductor elements, and a first insulating film over the semiconductor elements and having first openings therein at the locations of the first electrode pads, and
- a scribe area around the semiconductor chip area, the scribe area having second electrode pads coplanar with the first electrode pads, and
- projecting electrodes on only the first electrode pads in the semiconductor chip area.
Dependencies are inferred from the claim text.