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US 2011/0298088 A1Published application
Semiconductor Package with Integrated Inductor
AssigneeInfineon Technologies AG
InventorsKlaus Elian, Horst Theuss, Georg Meyer-Berg
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Abstract
A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core.
Claims24
A semiconductor package, comprising:
- a semiconductor chip,
- an inductor applied to the semiconductor chip, the inductor having at least one winding, and
- an encapsulation body formed of an encapsulation material, wherein the encapsulation material contains a magnetic component and fills a space within the at least one winding to form a magnetic winding core.
A method of manufacturing a semiconductor package, the method comprising:
- attaching a semiconductor chip to a carrier, the semiconductor chip including an inductor having at least one winding;
- and
- depositing an encapsulation material onto the semiconductor chip to form an encapsulation body, the encapsulation material containing a magnetic component and filling a space within the winding to form a magnetic winding core.
A semiconductor package, comprising:
- a semiconductor chip;
- and
- an inductor integrated in the semiconductor chip, the inductor having at least one winding;
- wherein the semiconductor chip comprises a hole running through the winding, the hole filled with a polymer material embedding magnetic particles.
1 more element
Dependencies are inferred from the claim text.