Electromechanical system having a controlled atmosphere, and method of fabricating same

A microelectromechanical device, the device comprising:

• a chamber including a first encapsulation layer, the first encapsulation layer including at least one vent;
• a microelectromechanical structure disposed at least substantially within the chamber;
• a semiconductor material disposed in or on the at least one vent to seal the chamber;
• and
• a fluid within the chamber, wherein:
• (i) a pressure of the fluid is within a predetermined range;
• (ii) a diffusivity of the fluid is sufficient to provide a predetermined and substantially constant damping of the microelectromechanical structure during its operation;
• and
• (iii) the fluid includes at least one by-product gas based on a gas used to form the semiconductor material.

A microelectromechanical device, the device comprising:

• a chamber including a first encapsulation layer, the first encapsulation layer including at least one vent;
• a microelectromechanical structure disposed at least substantially within the chamber;
• a semiconductor material disposed in or on the at least one vent to seal the chamber;
• and
• a fluid within the chamber, wherein:
• (i) a pressure of the fluid is within a predetermined range;
• (ii) a diffusivity of the fluid provides a predetermined and substantially constant damping of the microelectromechanical structure during its operation;
• and
• (iii) the fluid includes at least one substantially stable gas.

A method of producing a microelectromechanical device, the method comprising:

• selecting a pressure range;
• selecting a fluid diffusivity;
• providing a chamber including a first encapsulation layer, the first encapsulation layer including at least one vent;
• providing a microelectromechanical structure disposed at least substantially within the chamber;
• providing a semiconductor material disposed in or on the at least one vent to seal the chamber;
• determining a level of damping of the microelectromechanical structure during its operation;
• and
• providing a fluid within the chamber whose pressure is within the selected pressure range, and whose fluid diffusivity substantially constantly provides the determined damping level of the microelectromechanical structure during its operation;
• wherein the providing of the fluid includes forming the fluid at least partially as a by-product gas based on a gas used to form the semiconductor material.

A method of producing a microelectromechanical device, the method comprising:

• selecting a pressure range;
• selecting a fluid diffusivity;
• providing a chamber including a first encapsulation layer, the first encapsulation layer including at least one vent;
• providing a microelectromechanical structure disposed at least substantially within the chamber;
• providing a semiconductor material disposed in or on the at least one vent to seal the chamber;
• determining a level of damping of the microelectromechanical structure during its operation;
• and
• providing a fluid within the chamber whose pressure is within the selected pressure range, and whose fluid diffusivity substantially constantly provides the determined damping level of the microelectromechanical mechanical structure during its operation;
• wherein the providing of the fluid includes at least one substantially stable gas.