Wiring substrate and manufacturing method thereof
AssigneeShinko Electric Industries Co., Ltd.
InventorsMasahiro SUNOHARA, Shigeaki SUGANUMA
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Abstract
A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked with a copper alloy layer formed adjacent to the adhesive layer and interposed between the electrode layer and the wiring layer.
Claims5
A wiring substrate comprising:
- a wiring layer made of copper;
- an electrode layer made of copper;
- and
- an insulating layer arranged adjacent to the electrode layer,
- wherein the wiring layer is stacked on the electrode layer and the insulating layer,
- the insulating layer and the wiring layer are stacked with an adhesive layer interposed between the insulating layer and the wiring layer, and
- the electrode layer and the wiring layer are stacked with a copper alloy layer formed adjacent to the adhesive layer and interposed between the electrode layer and the wiring layer.
A manufacturing method of a wiring substrate, the method comprising:
- forming a metal layer on a surface of an electrode layer made of copper and arranged adjacent to an insulating layer, the metal layer being alloyable with copper;
- forming an adhesive layer over a whole surface of the insulating layer and part of a surface of the metal layer;
- forming a wiring layer using copper on a surface of the adhesive layer and an exposed surface of the metal layer on which the adhesive layer is not formed;
- and
- forming a copper alloy layer between the electrode layer and the wiring layer by performing a heat treatment with respect to the metal layer.
Dependencies are inferred from the claim text.