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US 2011/0297425 A1Published application
Wiring substrate and manufacturing method thereof
AssigneeShinko Electric Industries Co., Ltd.
InventorsJunichi Nakamura, Hitoshi Kondo, Tomoyuki Shimodaira, Katsutoshi Tanabe
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Abstract
A wiring substrate includes a plurality of insulating layers; and a plurality of wiring layers being alternately laminated, wherein an opening portion is formed in an outermost insulating layer to expose a part of the outermost wiring layer to an outside, a cross-sectional shape of a sidewall of the opening portion is concaved and curved, and the outermost wiring layer has a recess on a side exposed to the outside.
Claims14
A wiring substrate comprising:
- a plurality of insulating layers;
- and
- a plurality of wiring layers being alternately laminated,
- wherein an opening portion is formed in an outermost insulating layer to expose a part of the outermost wiring layer to an outside,
- a cross-sectional shape of a sidewall of the opening portion is concaved and curved, and
- the outermost wiring layer has a recess on a side exposed to the outside.
3 more elements
A manufacturing method of a wiring substrate comprising:
- laminating a plurality of insulating layers and a plurality of wiring layers alternately,
- forming, by a first blast process, an opening portion in an outermost insulating layer to expose a part of the outermost wiring layer to an outside,
- forming, by a second blast process, a recess in the outermost wiring layer on a side exposed by the opening portion to the outside .
Dependencies are inferred from the claim text.