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US 2011/0297088 A1Published application
Thin edge carrier ring
AssigneeTexas Instruments Incorporated
InventorsJian SONG, Ruben Anthony PESINA, Kamal AVALA
Life of this patent
Estimating the term…
Abstract
A PECVD deposition chamber with a circular pedestal with a recessed portion in the outer top surface of the pedestal. A PECVD deposition chamber with a circular wafer carrier ring with a recessed portion in the outer top surface of the wafer carrier ring.
Claims11
A PECVD deposition chamber, comprising:
- a circular wafer pedestal with a top surface diameter larger than a wafer diameter and with an outer recessed portion of said top surface where said recessed portion is outside said wafer diameter and where said recessed portion underlies an interface between a plasma edge and chamber ambient in said PECVD deposition chamber.
A PECVD deposition chamber, comprising:
- a wafer carrier ring with a recessed portion on the outer top side of said wafer carrier ring and where said recessed portion underlies an interface between a plasma edge and chamber ambient in said PECVD deposition chamber.
Dependencies are inferred from the claim text.