US 2011/0256812 A1 · CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES

Abstract

Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Claims20

Dependent claims

A method of conditioning a polishing pad, comprising:

contacting a surface of the polishing pad with a conditioning disk;
measuring a thickness of the polishing pad while sweeping the conditioning disk across the surface of the polishing pad;
comparing the measured thickness of the polishing pad to a standard thickness polishing pad profile;
and
adjusting a dwell time of the conditioning disk based on the comparison of the measured thickness of the polishing pad to the standard thickness polishing pad profile.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

13/087,180Filed 14 Apr 2011

Priority

20 Apr 2010

Published

20 Oct 2011

Term ends

Not estimatedThe source records don’t support an estimate.

Classification3 codes

B24B 53/017
Devices or means for dressing or conditioning abrasive surfaces: devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 37/042
Designed for working plane surfaces: operating processes therefor
B24B
Machines, devices, or processes for grinding or polishing

Closed-loop control for improved polishing pad profiles

Life of this patent

Closed-loop control for improved polishing pad profiles

Life of this patent

Abstract

Claims20