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US 2011/0256736 A1Published application
Method for processing a substrate using a laser beam
AssigneeSamsung Electronics Co., Ltd.
InventorsSung-il Cho, Ho-tae Jin, Heui-seog Kim, Seon-ju Oh
Life of this patent
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Abstract
A method for processing a substrate includes generating a first laser beam, splitting the first laser beam into a plurality of second laser beams, focusing the split second laser beams on a plane in the substrate parallel to a main surface of the substrate, and performing surface separation of the substrate along the plane.
Claims20
A method for processing a substrate, the method comprising:
- generating a first laser beam;
- splitting the first laser beam into a plurality of second laser beams;
- focusing the split second laser beams on a plane in the substrate, the plane being parallel to a main surface of the substrate;
- and
- performing surface separation of the substrate along the plane.
2 more elements
A method for processing a substrate, the method comprising:
- forming a reformed region on a plane in the substrate parallel to a main surface of the substrate;
- and
- separating the substrate along the plane of the substrate.
Dependencies are inferred from the claim text.