Pulsed Plasma to Affect Conformal Processing
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsHelen Maynard, Vikram Singh, Svetlana Radovanov, Harold Persing
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AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsHelen Maynard, Vikram Singh, Svetlana Radovanov, Harold Persing
Estimating the term…
A plasma processing method is provided. The plasma processing method includes using the after-glow of a pulsed power plasma to perform conformal processing. During the afterglow, the equipotential field lines follow the contour of the workpiece surface, allowing ions to be introduced in a variety of incident angles, especially to non-planar surfaces. In another aspect of the disclosure, the platen may be biased positively during the plasma afterglow to attract negative ions toward the workpiece. Various conformal processing steps, such as implantation, etching and deposition may be performed.
A method of processing a workpiece comprising:
A method of introducing ions to a non-planar workpiece surface, comprising:
A method of conformal processing of a workpiece comprising:
Dependencies are inferred from the claim text.