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US 2011/0256310 A1Published application
Method for manufacturing insert-molded cover
AssigneeFoxconn Technology Co., Ltd.
InventorsHAN-MING LEE, CHIH-CHIEN HUNG, HSIANG-SHENG CHOU, CHING-HSIEN CHANG
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Abstract
A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.
Claims8
A method for manufacturing an insert-molded cover for electronic devices, comprising:
- manufacturing a metallic body;
- processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body;
- and
- molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.
1 more element
Dependencies are inferred from the claim text.