Integrated and sealed opto-electronic device assembly

An opto-electronic device assembly adapted for mounted on a mother board, comprising:

• a case having multiple cavities defined by a top wall, a rear wall and a pair of end walls and partitioned by at least one partition ribs, the cavities open forwards and downwards;
• opto-electronic devices, each comprising:
• an optical engine module comprising an optical engine and, an optical transmission interface and an electrical transmission interface, the electrical transmission interface having electrical pads;
• an electrical socket comprising a plurality of terminals with one ends contacting with PCB and another opposite ends;
• each electrical transmission interface being removeably assembled in the electrical socket and said another opposite ends of the terminals of the electrical socket contacting with the electrical pads to complete electrical connection;
• wherein the opto-electrical devices are received in the cavities in a condition that the optical transmission interfaces exposes to a front open of the case.