Method and System for Automated Ball-Grid Array Void Quantification

A system for identifying voids in solder balls in a ball-grid array (BGA) using an image of the BGA, the system comprising:

• a controller configured to
• localize an image of a solder ball on the BGA image, the solder ball image having a radius and comprising a plurality of points, each point having an image intensity,
• produce a void-free model image of the solder ball based on the radius of the solder ball image, the void-free model image comprising a plurality of points, each point having an image intensity,
• compute a difference between the image intensities of the points of the solder ball image and the image intensities of the points of the void-free model image to produce a residual image, the residual image comprising a plurality of points, each point having an image intensity, and
• identify a void using the residual image;
• and
• an output device configured to output data representing the identified void.

A storage medium having computer executable instructions recorded thereon for identifying voids in solder balls in a ball-grid array (BGA) using an image of the BGA, the computer executable instructions comprising instructions for:

• localizing an image of a solder ball on the BGA image, the solder ball image having a radius and comprising a plurality of points, each point having an image intensity;
• producing a void-free model image of the solder ball based on the radius of the solder ball image, the void-free model image comprising a plurality of points, each point having an image intensity;
• computing a difference between the image intensities of the points of the solder ball image and the image intensities of the points of the void-free model image to produce a residual image, the residual image comprising a plurality of points, each point having an image intensity;
• identifying a void using the residual image;
• and
• outputting data representing the identified void.