Heat sink assembly and electronic device employing the same

A heat sink assembly, mounted on a circuit board comprising at least one electronic component and a plurality of latching slots surrounding the electronic component, the heat sink assembly comprising:

• a heat sink, comprising a base and a plurality of heat fins extending upwardly from the base, wherein a plurality of slots are defined between the plurality of heat fins;
• a heat transmitting film, attached to the heat sink to transmit heat from the electronic component to the heat sink;
• and
• a shielding frame, comprising a hollow frame, a plurality of latch portions and a plurality of limitation portions, the plurality of latch portions disposed on one end of the hollow frame and evenly spaced apart from each other, the plurality of limitation portions extending from the other end of the hollow frame;
• wherein the shielding frame is attached to the heat sink via inserting the plurality of limitation portions into the corresponding slots, each of the plurality of latch portions is inserted into the corresponding latching slot to install the shielding frame to the circuit board, the shielding frame cooperates with the heat sink to shield the electronic component from electromagnetic interference (EMI).