Inkjet head assembly and method for manufacturing the same

An inkjet head assembly, comprising:

• an inkjet head plate including an ink path;
• a piezoelectric actuator facing a pressure chamber in the inkjet head plate and providing driving force for ejecting ink to a nozzle from the pressure chamber;
• a package part constituted by a silicon layer where a via penetrating the top and bottom and a glass layer bonding the silicon layer and the inkjet head plate to each other, and moving ink introduced from the outside to an inlet of the inkjet head plate;
• and
• an electrical connector filled in the via and electrically connected with the piezoelectric actuator.

A method for manufacturing an inkjet head assembly, comprising:

• forming an ink path in an inkjet head plate;
• forming a piezoelectric actuator providing driving force for ejecting ink to a nozzle in a pressure chamber of the inkjet head plate to face the pressure chamber;
• processing a package part to include a path moving ink introduced from the outside to an inlet of the inkjet head plate and a via penetrating the top and bottom;
• forming an electrical connector in the via to electrically connect with the piezoelectric actuator;
• and
• stacking and bonding the package part onto the inkjet head plate.