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US 2011/0254413 A1Published application
Casing of electronic device and manufacturing method thereof
OwnerSheng Yu Tsaiinventor
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Abstract
A casing of an electronic device and a manufacture method thereof are disclosed. A thin film with a protecting film is provided in a mold. Plastic is injected into the mold from an injection inlet of the mold to form the casing, and the location of the protecting film corresponds to that of the injection inlet. After the casing is formed, the protecting film and the plastic are molded integratedly.
Claims9
A method for manufacturing a casing of an electronic device, comprising:
- providing a thin film along with a protecting film in a mold;
- and
- injecting plastic to the mold from an injection inlet of the mold to form the casing;
- wherein the position of the protecting film corresponds to that of the injection inlet, and after the casing is formed, the protecting film and the plastic are integrated.
1 more element
A casing of an electronic device, comprising:
- a casing body made of plastic, polyimide, acrylic ester copolymer, rosin ester resin and polyethylene (PE).
Dependencies are inferred from the claim text.