US 2011/0254171 A1 · Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects

Abstract

Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer electronics such as elastic displays, skin-like electronic sensors, etc. In particular, stretchable neural implants provide improved performances as to cause less mechanical stress and thus fewer traumas to surrounding soft tissues. Such SMCMs usually comprise of various electronic components attached to or embedded in a polydimethylsiloxane (PDMS) substrate and wired through stretchable interconnects. However, reliably and compactly connecting the electronic components to PDMS-based stretchable interconnects is very challenging. This invention describes an integrated method for high-density interconnection of electronic components through stretchable interconnects in an SMCM. This invention has applications in high-density SMCMs, as well as high-density stretchable/conformable neural interfaces.

Claims20

Dependent claims

A method of bonding flexible interconnects to a substrate, comprising the steps of:

coating the substrate with a layer of negative photoresist;
photo-lithographically patterning the negative photoresist layer to produce tapered posts on the substrate wherein said photo-lithographically patterning involves purposely adding a gap between said negative photoresist layer surface and a photomask to modulate the UV light intensity profile by aperture diffraction;
forming a polydimethylsiloxane layer no thicker than the height of said tapered posts on said substrate wherein said polydimethylsiloxane layer is formed by spin-coating and thermal curing;
forming inclined-vias in said polydimethylsiloxane layer wherein said inclined-vias have inclined slopes and are molded by said tapered posts after removal of said tapered posts by acetone and plasma etching;
and
patterning thin film interconnects on said polydimethylsiloxane layer wherein the portion of said thin film interconnect deposited on slopes and bottom of said inclined-via electrically connects to a bonding pad on said substrate.

3 more elements

Dependencies are inferred from the claim text.

Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects

Life of this patent

Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects

Life of this patent

Abstract

Claims20