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AssigneeBroadcom Corporation
InventorsTarek Kaylani, Zhihui Wang, Kenneth Kindsfater, Balasubramanian Annamalai, Jeff Echtenkamp
Estimating the term…
According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.
A semiconductor die with on-die preferred interface selection, said semiconductor die comprising:
A semiconductor package including a semiconductor die with on-die preferred interface selection, said semiconductor die comprising:
An electronic system comprising a semiconductor die with on-die preferred interface selection, said semiconductor die comprising:
Dependencies are inferred from the claim text.