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US 2011/0254123 A1Published application
Ultra high speed signal transmission/reception
AssigneeScanimetrics Inc.
InventorsChristopher V. SELLATHAMBY, Steven SLUPSKY, Brian MOORE
Life of this patent
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Abstract
There is provided, in combination, an integrated circuit chip, a device, and a multilayered structure mounted between the integrated circuit chip and the device. The multilayered structure has signal pathways that transfer signals between the integrated circuit chip and the device, and at least one signal pathway with a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in one of the integrated circuit chip, the device, and the multilayered structure.
Claims10
In combination:
- an integrated circuit chip;
- a device;
- a multilayered structure mounted between the integrated circuit chip and the device, the multilayered structure comprising:
- signal pathways that transfer signals between the integrated circuit chip and the device;
- at least one signal pathway comprising a first wireless coupling element in the multilayered structure that is in communication with a second wireless coupling element in the integrated circuit chip, the device, or the multilayered structure.
2 more elements
Dependencies are inferred from the claim text.