Semiconductor device having non-silicide region in which no silicide is formed on diffusion layer
AssigneeKabushiki Kaisha Toshiba
InventorsTakayuki Hiraoka, Kuniaki Utsumi, Tsutomu Kojima, Kenji Honda
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AssigneeKabushiki Kaisha Toshiba
InventorsTakayuki Hiraoka, Kuniaki Utsumi, Tsutomu Kojima, Kenji Honda
Estimating the term…
A semiconductor device includes first and second MOSFETs corresponding to at least first power source voltage and second power source voltage lower than the first power source voltage, and non-silicide regions formed in drain portions of the first and second MOSFETs and having no silicide formed therein. The first MOSFET includes first diffusion layers formed in source/drain portions, a second diffusion layer formed below a gate portion and formed shallower than the first diffusion layer and a third diffusion layer formed with the same depth as the second diffusion layer in the non-silicide region, and the second MOSFET includes fourth diffusion layers formed in source/drain portions, a fifth diffusion layer formed below a gate portion and formed shallower than the fourth diffusion layer and a sixth diffusion layer formed shallower than the fourth diffusion layer and deeper than the fifth diffusion layer in the non-silicide region.
A semiconductor device comprising:
Dependencies are inferred from the claim text.