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US 2011/0254049 A1Published application
Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKazuhiro SHIMIZU, Hajime AKIYAMA, Naoki YASUDA
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsKazuhiro SHIMIZU, Hajime AKIYAMA, Naoki YASUDA
Estimating the term…
A semiconductor device manufacturing apparatus is provided with a drawing pattern printing part having a print head which injects a conductive solvent, an insulative solvent and an interface treatment solution. The print head is formed in such a way that desired circuit drawing pattern can be printed on a wafer based on information on the drawing pattern from a wafer testing part, information on the wafer from a storage part and coordinate information from a chip coordinate recognition part. In a semiconductor device manufacturing method according to the present invention, a semiconductor device is manufactured by using the semiconductor device manufacturing apparatus in such a manner that desired circuits are formed through printing process. In the semiconductor device, pad electrodes and so on are formed in such a way that trimming process can be conducted by printing circuit drawing patterns.
A semiconductor device manufacturing method comprising the steps of:
A semiconductor device manufacturing method comprising the steps of:
A semiconductor device comprising a trench portion having a predetermined depth which is formed in a drawn pattern formation region for trimming of each chip of a wafer, wherein the sidewalls of said trench portion are inclined in such a way that the sidewalls have an inclination of 5 degrees or greater and the opened side of said trench portion widens, and conductive wiring is formed inside said trench portion.
A semiconductor device comprising at least two pad electrodes for trimming, which are formed on the surface of each chip in wafer form, wherein said pad electrodes have been exposed from a passivation film, and a drawing pattern is formed on said pad electrodes for trimming through printing process base on the result of a check for a necessity for trimming.
A semiconductor device which is an IGBT chip, wherein
A semiconductor device which is a nonvolatile memory in which an electrostatic shielding film body to be grounded is formed so as to cover a memory region through printing process and molding is conducted so as to cover the electrostatic shielding film body.
Dependencies are inferred from the claim text.