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US 2011/0254000 A1Published application
Semiconductor chip embedded with a test circuit
AssigneeHynix Semiconductor Inc.
InventorKwon Whan HAN
Life of this patent
Estimating the term…
Abstract
A semiconductor chip includes a semiconductor chip body having a first surface on which pad parts are formed and an opposing second surface. Through-electrodes may be connected to the pad parts and formed to pass through the semiconductor chip body. Determination units may be connected to the through-electrodes and may be enabled to determine whether the pad parts and the through-electrodes are electrically connected with each other.
Claims20
A semiconductor chip comprising:
- a semiconductor chip body having a first surface on which pad parts are formed and an opposing second surface;
- through-electrodes connected to the pad parts and formed to pass through the semiconductor chip body;
- and
- determination units connected to the through-electrodes and enabled to determine whether the pad parts and the through-electrodes are electrically connected with each other.
1 more element
A semiconductor chip comprising:
- a semiconductor chip body having a first surface on which pad parts are formed and an opposing second surface;
- connection lines connecting the pad parts with one another;
- test pads disposed under the pad parts in the semiconductor chip body;
- through-electrodes connected to the pad parts and formed to extend from the second surface of the semiconductor chip body through the test pads;
- and
- determination units enabled to determine whether the pad parts and the through-electrodes are electrically connected with each other.
3 more elements
A semiconductor chip comprising:
- a semiconductor chip body having a first surface on which pad parts are formed and an opposing second surface;
- connection lines connecting the pad parts with one another;
- test pads formed on the second surface of the semiconductor chip body;
- through-electrodes connected to the pad parts and formed to extend from the second surface of the semiconductor chip body through the test pads;
- and
- determination units enabled to determine whether the pad parts and the through-electrodes are electrically connected with each other.
3 more elements
Dependencies are inferred from the claim text.