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US 2011/0253530 A1Published application
Substrate holding device and sputtering apparatus having same
AssigneeHon Hai Precision Industry Co., Ltd.
InventorCHIA-YING WU
Life of this patent
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Abstract
A holding device includes a spindle, a number of aligned adapting members and a number of holders. The adapting members are mounted on the spindle. Each holder is movably coupled with a corresponding adapting member such that the distance between each holder and the spindle is adjustable.
Claims20
A holding device, comprising:
- a spindle;
- a plurality of aligned adapting members mounted on the spindle;
- and
- a plurality of holders each movably coupled with a corresponding adapting member such that the distance between each holder and the spindle is adjustable.
1 more element
A sputtering apparatus, comprising:
- a target;
- a plurality of substrates;
- a holding device comprising:
- a spindle rotatable about a central axis thereof, the spindle being substantially parallel to the target;
- a plurality of aligned adapting members mounted on the spindle;
- and
- a plurality of holders securing the respective substrates thereto, each holder movably coupled with a corresponding adapting member such that the distance between each substrate and the target is adjustable.
4 more elements
Dependencies are inferred from the claim text.