Back to results
US 2011/0253428 A1Published application
Circuit board with notched stiffener frame
AssigneeAdvanced Micro Devices, Inc.
InventorsKevin W. Lim, Seah S. Too, Mohammad Z. Khan
Life of this patent
Estimating the term…
Abstract
Various embodiments of a semiconductor chip device that include a circuit board and a stiffener frame and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a circuit board and coupling a stiffener frame to the circuit board. The stiffener frame includes a first opening that defines an interior wall. The interior wall includes a notch.
Claims22
A method of manufacturing, comprising:
- providing a circuit board;
- and
- coupling a stiffener frame to the circuit board, the stiffener frame including a first opening defining an interior wall, the interior wall including a notch.
A method of manufacturing, comprising:
- providing a semiconductor chip package substrate;
- and
- coupling a stiffener frame to the semiconductor chip package substrate, the stiffener frame including a first opening defining an interior wall, the interior wall including a notch.
An apparatus, comprising:
- a circuit board;
- and
- a stiffener frame coupled to the circuit board, the stiffener frame including a first opening defining an interior wall, the interior wall including a notch.
Dependencies are inferred from the claim text.