Chemical Composition and Methods for Removing Epoxy-Based Photoimageable Coatings Utilized In Microelectronic Fabrication
OwnerJohn Mooreinventor
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Abstract
The present invention is a chemical composition to remove epoxy-based photoimageable coatings that include a solvent system to dissolve and rinse away the coating, an acidic additive that hydrolyzes the coating and releases a plurality of monomeric forms to the solvent, a plurality of inhibitors that protect any exposed substrate and a surfactant to lower a surface tension of the coating on the substrate. The composition can be utilized with a method for removing a partial cured and a fully cured epoxy-based photoimageable coating from a substrate with the composition to remove epoxy-based photoimageable coatings.
Claims20
A composition to remove epoxy-based photoimageable coatings, comprising:
- a solvent system to dissolve and rinse away said coating;
- and
- an acidic additive that hydrolyzes said coating and releases a plurality of monomeric forms to said solvent.
A method for removing a partial cured epoxy-based photoimageable coating from a substrate with a composition to remove epoxy-based photoimageable coatings, comprising:
- applying said composition to said coating utilizing a sprayer, an immersion bath, wipe, or brush;
- exposing said composition directly on said coating for a predetermined period of time at a predetermined temperature;
- and
- rinsing and drying said exposed substrate.
A method for removing a fully cured epoxy-based photoimageable coating, comprising:
- applying said composition to said coating;
- heating said substrate at a predetermined temperature and a predetermined period of time to allow said composition to penetrate said coating and initiate bond-breaking of said coating;
- rinsing said substrate and said coating with water;
- and
- drying said substrate.
Dependencies are inferred from the claim text.