Template and method of manufacturing the same, and semiconductor device manufacturing method using the template
OwnerIkuo YONEDAinventor
Life of this patent
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Abstract
According to one embodiment, there is provided a template which includes a first region and a second region. The first region is provided with a first pattern of a plurality of recessed portions formed on a main surface of the template, and has a first thickness. The second region is provided with a second pattern of a plurality of recessed portions formed on the main surface of the template, and has a second thickness different from the first thickness. The second pattern is different from the first pattern in at least one of interval and dimension of the recessed portions.
Claims20
A template comprising:
- a first region being provided with a first pattern of a plurality of recessed portions formed on a main surface of the template, and having a first thickness;
- and
- a second region being provided with a second pattern of a plurality of recessed portions formed on the main surface of the template, and having a second thickness different from the first thickness, the second pattern being different from the first pattern in at least one of interval and dimension of the recessed portions.
A template comprising:
- a first region being provided near a center of the template, being provided with a first pattern of a plurality of recessed portions formed on a main surface of the template, and including a thick portion having a first thickness formed therein;
- a second region being provided adjacent to the first region, being provided with a second pattern of a plurality of recessed portions formed on the main surface of the template, the second pattern being greater in interval between the recessed portions than the first pattern, and including formed therein a thin portion having a second thickness less than the first thickness;
- and
- a third region being provided adjacent to the first region, being provided with a third pattern of a plurality of recessed portions formed on the main surface of the template, the third pattern being greater in interval between the recessed portions than the second pattern, and including formed therein a thin portion having a third thickness less than the second thickness.
A template manufacturing method comprising:
- preparing a substrate including a main surface and a back surface opposite to each other;
- performing a cutting process of cutting a predetermined region of the back surface to a predetermined depth from the back surface, thereby forming a thin portion;
- sequentially forming a metal film and a resist film on the main surface;
- patterning the resist film to form a resist pattern;
- etching the metal film with the resist pattern as a mask;
- etching the main surface of the substrate with the patterned metal film as a mask to form a first pattern of a plurality of recessed portions in a first region including a thick portion not cut by the cutting process and form a second pattern of a plurality of recessed portions in a second region including the thin portion, the second pattern being smaller in at least one of interval and dimension of the recessed portions than the first pattern.
Dependencies are inferred from the claim text.