Method Of Forming Package-On-Package And Device Related Thereto

A method of forming a semiconductor package, comprising:

• forming a plurality of through silicon vias (TSVs) through an upper surface of a wafer, the wafer having a plurality of first semiconductor chips, the plurality of TSVs being formed to have lower ends buried in the wafer and upper ends exposed by one surface of the wafer;
• forming an encapsulant on the wafer using a wafer level molding process, the encapsulant being formed to cover the upper ends of the TSVs;
• partially removing a lower surface of the wafer to expose the lower ends of the TSVs;
• forming openings through the encapsulant, the openings being aligned on the upper ends of the TSVs;
• dividing the encapsulant and the wafer to form a plurality of first semiconductor packages;
• and
• stacking a second semiconductor package on a first semiconductor package selected from the plurality of first semiconductor packages, the second semiconductor package being electrically connected to the TSVs.

A method of forming a semiconductor package, comprising:

• forming an encapsulant on at least one of an upper and lower surface of a wafer, the wafer including a plurality of first semiconductor chips and a plurality of first through silicon vias;
• forming a plurality of first openings in the encapsulant;
• dividing the encapsulant and the wafer to form a first plurality of first semiconductor packages, each of the first semiconductor packages including at least one first semiconductor chip, at least one first opening, and at least one first through silicon via;
• providing a second semiconductor package including at least one external contact terminal and at least one second semiconductor chip;
• and
• inserting the at least one external contact terminal into the at least one first opening of the of the one of the first semiconductor packages to electrically connect the at least one second semiconductor chip to the at least one first semiconductor chip of the one of the first semiconductor packages.