Method of manufacturing semiconductor device by using compression molding

Abstract

A method of manufacturing a semiconductor device comprises: determining whether or not the viscosity of a sealing resin at a first temperature lower than the melting temperature of the sealing resin is less than or equal to a first reference value which prevents poor sealing from occurring at the first temperature, for each lot in which the corresponding sealing resin is manufactured; selecting the sealing resin of the lot when the viscosity of the sealing resin at the first temperature is less than or equal to the first reference value; introducing the sealing resin selected in selecting the sealing resin into a mold of a compression molding apparatus; and sealing a semiconductor chip mounted over a substrate with the sealing resin by compression molding using the mold heated at a second temperature higher than the first temperature after introducing the sealing resin.

Dependencies are inferred from the claim text.