Pulsed processing semiconductor heating methods using combinations of heating sources

A method for processing an object having opposing major surfaces including first and second surfaces, said method comprising:

• applying heat in a controllable way to the object during a background heating mode using a heating arrangement thereby selectively heating the object to at least generally produce a temperature rise throughout the object such that the object reaches a first temperature;
• heating the first surface of the object using the heating arrangement in a pulsed heating mode, cooperating with said background heating mode, by subjecting the first surface to a sequence of pulses of energy each having a pulse duration;
• and
• terminating said background heating mode in timed relation to initiating said sequence of pulses.

A system for processing an object having opposing major surfaces including first and second surfaces, said system comprising:

• a background heater to apply heat in a controllable way to the object during a background heating mode thereby selectively heating the object to at least generally produce a temperature rise throughout the object such that the object reaches a first temperature;
• a pulsed heating arrangement to heat the first surface of the object in a pulsed heating mode, cooperating with said background heating mode, by subjecting the first surface to a sequence of pulses of energy each having a pulse duration;
• and
• a controller for terminating said background heating mode in timed relation to initiating said sequence of pulses.