High speed piezoelectric optical system with tunable focal length
AssigneeThe Charles Stark Draper Laboratory, Inc.
InventorMark J. Mescher
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AssigneeThe Charles Stark Draper Laboratory, Inc.
InventorMark J. Mescher
Estimating the term…
A varifocal optical system includes a substantially circular membrane deposited on a substrate, and a ring-shaped PZT thin film deposited on the outer portion of the circular membrane. The membrane may be a MEMS-micromachined membrane, made of thermal oxide, polysilicon, ZrO2 and SiO2. The membrane is initially in a buckled state, and may function as a mirror or a lens. Application of an electric voltage between an inner and outer electrode on the piezoelectric thin film induces a lateral strain on the PZT thin film, thereby altering the curvature of the membrane, and thus its focal length. Focal length tuning speeds as high as 1 MHz have been demonstrated. Tuning ranges of several hundred microns have been attained. The varifocal optical system can be used in many applications that require rapid focal length tuning, such as optical switching, scanning confocal microscopy, and vibration compensation in optical storage disks.
A varifocal optical system, the optical system comprising:
An optical system with tunable focal length, the optical system comprising:
An optical switch, comprising:
A varifocal lens, comprising:
A varifocal lens, comprising:
A varifocal optical lens for sample height variation compensation in a scanning confocal microscope of the type including a beamsplitter, an objective lens for focusing light transmitted by said beamsplitter onto a spot in its focal plane, and a pinhole aperture disposed adjacent to a detector for preventing light from out-of-focus portions of said sample from reaching said detector, said varifocal optical lens comprising:
A method for tuning the focal length of an optical element, said method comprising:
A method according to claim 28, wherein the step of etching said substrate includes the step of performing backside deep RIE (reactive ion etching) through-wafer etching of said substrate.
Dependencies are inferred from the claim text.