Heat dissipation apparatus and electronic assembly with same

An electronic assembly, comprising:

• a circuit board defining a plurality of receiving holes therein;
• an electronic component mounted on the circuit board;
• a base plate mounted on the electronic component, the base plate comprising a plurality of mounting arms extending outwardly therefrom, each mounting arm defining a through hole at a free end thereof, and an inner thread formed on an inner surface of each through hole;
• and
• a plurality of fasteners attached in the through holes of the mounting arms, each fastener comprising a main post, a cap formed at a top of the main post, and a engaging portion formed at a bottom of the main post, the engaging portion of each fastener received in a corresponding receiving hole of the circuit board, the cap abutting the corresponding mounting arm and exerting a downward force urging the base plate towards the electronic component;
• wherein a retaining thread is formed on an outer surface of the main post adjacent the engaging portion, the retaining thread of the main post matching the inner thread of the through hole of the corresponding mounting arm, and the retaining thread of the main post configured to pass down through the through hole of the mounting arm by threadingly passing the retaining thread of the main post through the inner thread of the through hole whereupon the fastener remains preassembled in the through hole.