Heat dissipation apparatus and electronic assembly with same

An electronic assembly, comprising:

• a circuit board defining a plurality of receiving holes therein;
• an electronic component mounted on the circuit board;
• a heat sink mounted on the electronic component, the heat sink defining a plurality of through holes therein, an inner thread formed on an inner surface of each through hole;
• and
• a plurality of fasteners attached in the through holes of the heat sink, respectively, each fastener comprising a bolt and a spring coiled around the bolt, the bolt comprising a main post, a cap formed on a top of the main post, and a engaging portion formed on a bottom of the main post, the engaging portion of each fastener received in a corresponding receiving hole of the circuit board, the spring compressed between the cap and the heat sink to exert a downward force impelling the heat sink towards the electronic component;
• wherein a retaining thread is formed on an outer surface of the main post above the engaging portion, the retaining thread matches the inner thread of the corresponding through hole of the heat sink, and the retaining thread of the main post is configured to pass through the through hole of the mounting arm by threading the retaining thread of the main post through the inner thread of the through hole.