Reducing Adherence in a MEMS Device
AssigneeTexas Instruments Incorporated
InventorWalter M. Duncan
Life of this patent
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Abstract
In one embodiment, an apparatus for reducing adherence in a micro-electromechanical system (MEMS) device comprises a substrate. A MEMS is disposed outwardly from the substrate. The MEMS comprises structures and corresponding landing pads. Dibs are disposed outwardly from the substrate. Each dib has a surface with depressions. An adherence-reducing material is disposed within each depression. The adherence-reducing material reduces adherence between at least a portion of a structure and a corresponding landing pad.
Claims10
1-11. (canceled)
A method, comprising:
- forming a plurality of indentations in a surface of a wafer;
- forming a plurality of dibs from the wafer;
- disposing the plurality of dibs outwardly from a substrate;
- saturating the plurality of dibs with an adherence-reducing material to dispose the adherence-reducing material within the plurality of indentations;
- and
- disposing a micro-electromechanical system (MEMS) device outwardly from the substrate, the MEMS device comprising a plurality of structures and a plurality of corresponding landing areas, the adherence-reducing material operable to reduce adherence between at least a portion of a structure and a corresponding landing area.
The method of claim 11, the forming the plurality of indentations in the surface of the wafer further comprising:
- etching the wafer to form the plurality of indentations.
The method of claim 11, the saturating the plurality of dibs with the adherence-reducing material further comprising:
- saturating the plurality of dibs with the adherence-reducing material.
The method of claim 11, the forming the plurality of dibs from the wafer further comprising:
- dicing the wafer to form the plurality of dibs from the saturated wafer.
The method of claim 11, the disposing the plurality of dibs outwardly from a substrate further comprising:
- attaching the plurality of dibs to the substrate with a die attach epoxy.
The method of claim 11, the adherence-reducing material comprising a passivant operable to lubricate at least one of the structure or the corresponding landing area.
The method of claim 11, the adherence-reducing material comprising a surfactant operable to reduce a surface energy of at least one of the structure or the corresponding landing area.
The method of claim 11, the adherence-reducing material comprising a getter operable to reduce moisture of at least one of the structure or the corresponding landing area.
The method of claim 11, the each dib comprising at least one of a semiconductive, insulating, or conductive material.
Dependencies are inferred from the claim text.