Etchant for metal wiring and method for manufacturing metal wiring using the same

A method of manufacturing metal wiring, comprising:

• forming a single layer comprising copper or a multilayer comprising titanium and copper on a substrate;
• and
• etching the single layer or the multilayer by using an etchant,
• wherein the etchant comprises ammonium persulfate, an organic acid, an ammonium salt, a fluorine-containing compound, a glycol-based compound, and an azole-based compound.