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US 2011/0226512 A1Published application
Heatsink Device Having A Rapid Heatsink Effect
OwnerYao-Tsung Kaoinventor
Life of this patent
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Abstract
A heatsink device includes a heatsink body and at least one heatsink member. The heatsink member is made of a metallic material different from that of the heatsink body. The heatsink member is combined with the heatsink body by a friction welding machine without needing any solder, conducting paste, adhesive or bonding agent, so that the heatsink body is directly combined with the heatsink member without an obstruction located between the heatsink body and the heatsink member so as to enhance the heatsink effect of the heatsink device.
Claims4
A heatsink device, comprising:
- a heatsink body;
- a cooling fan mounted on a top of the heatsink body;
- and at least one heatsink member combined with the heatsink body;
- wherein the heatsink body is combined with a circuit board;
- the heatsink body has an upper end provided with a plurality of heatsink fins and a plurality of heatsink channels defined between the heatsink fins;
- the improvement of the heatsink device, comprising:
- the heatsink body is made of a metallic material;
- the heatsink member is made of a metallic material different from that of the heatsink body;
- the heatsink member is combined with the heatsink body in a friction welding manner without needing any solder.
6 more elements
Dependencies are inferred from the claim text.