Composite stamp for embossing

A method of manufacturing a composite stamp for embossing, the method comprising the steps of:

• (a) taking a master structure having a conductive surface and dielectric features thereon;
• (b) electro-depositing a metal on exposed regions of the conductive surface to form a metal mask;
• (c) coating the dielectric features and metal mask with a fluid material that is capable of being transformed into a form-retaining material;
• (d) causing or permitting the fluid material to be transformed to a form-retaining material which is bonded to the metal mask;
• and
• (e) removing the form-retaining material and bonded metal mask from the master structure to provide the composite stamp.

A composite structure for making a composite stamp for embossing, the composite structure comprising:

• (a) a master structure comprising a support layer having a conductive surface and dielectric features thereon;
• (b) an opaque mask on the conductive surface adjacent to the dielectric features;
• (c) a form-retaining layer of a cured resin or thermoplastic material on the opaque mask and the dielectric features;
• and
• (d) a stamp substrate bonded to the form-retaining layer;
• wherein
• (e) the opaque mask is bonded more strongly to the form-retaining layer than it is to the conductive surface;
• and
• (f) the dielectric features are bonded more strongly to the conductive surface than to the form-retaining layer.