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AssigneeIndustrial Technology Research Institute
InventorsKuo-Hua Tseng, Chang-Ho Liou, Ming-Daw Chen, Kuan-Wei Chen
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A flat speaker apparatus including a driving circuit module, a flat speaker and a thermally conductive connector, and with a heat dissipating structure is introduced. The flat speaker includes a porous electrode and a vibrating film. The porous electrode causes the vibrating film to vibrate according to an audio signal output from the driving circuit module for generating sound. The thermally conductive connector connects the driving circuit module and the flat speaker to conduct heat from the driving module to the flat speaker for dissipation. A method for heat dissipation of the flat speaker is also introduced herein.
A flat speaker apparatus with a heat dissipating structure, comprising:
A method of heat dissipation of a flat speaker suitable for a flat speaker apparatus, wherein the flat speaker apparatus at least comprises a driving circuit module and a flat speaker, the flat speaker at least comprises a porous electrode and a vibrating film, a heat dissipation method of the flat speaker comprising:
A flat speaker apparatus with a heat dissipating structure, comprising:
Dependencies are inferred from the claim text.