Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly

A socket into which a semiconductor module having a printed circuit board and a plurality of semiconductor devices mounted on the printed circuit board is inserted, the socket comprising:

• a base member configured to couple to the printed circuit board of the semiconductor module;
• and
• a plurality of latch members configured to secure the printed circuit board to the base member, the base member including,
• an inner body having a slot into which a first end of the printed circuit board is inserted;
• an outer body coupled to the inner body, the outer body being formed of metal, and the outer body including,
• a plurality coupling portions, a first coupling portion being formed at a first end of the outer body, and a second coupling portion being formed at a second end of the outer body;
• and
• a plurality of lower grooves formed in the plurality coupling portions and configured to allow lower portions of the printed circuit board to be inserted thereinto;
• and
• the plurality of latch members including,
• a first latch body and a second latch body including metal, the first latch body pivotably coupled to the first coupling portion and the second latch body pivotably coupled to the second coupling portion;
• and
• a first upper groove formed in the first latch body and a second upper groove formed in the second latch body configured to allow each of upper portions of the printed circuit board to be inserted thereinto.

A semiconductor module/socket assembly comprising:

• a semiconductor module including;
• a printed circuit board including a plurality of insulating layers and a plurality of metal layers that are alternately stacked;
• and
• a plurality of semiconductor devices mounted on the printed circuit board;
• and
• a socket for the semiconductor module including,
• a base member including an inner body having a slot into which a lower end of the printed circuit board is inserted, an outer body formed of metal coupled to the inner body, and the outer body including,
• a first coupling portion formed at a first end of the outer body and a second coupling portion formed at a second end of the outer body, and lower grooves formed in the first and the second coupling portions, and the lower groves configured to allow lower portions of a first and a second ends of the printed circuit board to be inserted thereinto, and the first end and the second end are at opposite ends of the printed circuit board, and
• a first latch member formed of metal and including a first latch body, the first latch body being pivotably coupled to the first coupling portion, and a second latch member formed of metal and including a second latch body, the second latch body being pivotably coupled to the second coupling portion, and the first and the second latch members configured to allow upper portions of the first and the second ends of the printed circuit board to be inserted thereinto,
• wherein exposed portions of the plurality of metal layers are exposed to the outside of the semiconductor module at the first and the second ends of the printed circuit board, and the exposed portions of the plurality of metal layers contact the outer body, the first latch body and the second latch body the upper grooves, and the first coupling portion and the second coupling portion in the lower grooves.